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NXP Introduces ULC+ Concept

Posted on September, Thursday 06, 2007 By itVARnews Staff

NXP's single-chip solution drives next wave of ultra low-cost handsets with fully integrated multimedia functionality.



Underscoring its commitment to developing wireless technology in emerging markets, NXP Semiconductors (NXP) announced its Nexperia PNX4903 GSM/GPRS-optimized multimedia solution for the Ultra Low-Cost (ULC) segment of the mobile handset market. Delivering complete system-level operation in a single monolithic IC, the PNX4903 provides the highest levels of integration and performance and is the most cost-effective solution available for multimedia-enabled ULC handsets. Representing the ULC+ concept, NXP's solution raises the bar and allows handset OEMs/ODMs to deliver new levels of rich, multimedia content to entry-level cell phone users in a reliable, cost- and power-efficient package.

The Nexperia PNX4903 addresses competitive ULC market demands for the combination of RF performance, power consumption metrics, features and total cost. Superior RF performance allows significant flexibility in network planning, particularly in emerging markets where network coverage ten

ds to be sparse in rural areas. In over-subscribed urban areas, phones that have sub-par RF performance can create interference on neighboring channels, thereby impacting overall cellular network efficiency. Superior power consumption performance facilitates consistent phone operation as the battery discharges while allowing for industry-leading standby and talk times. The smaller batteries that can be utilized also allow for thinner and lighter handset designs.

In addition, the ULC+ multimedia solution enables a music phone with color screen, MP3 playback, removable flash memory card and FM Tuner for a total bill of materials under USD$20. While traditional multi-chip handset designs require three times the number of external components on a more complex printed circuit board, the PNX4903 allows a complete, dual-band GSM/GPRS modem to be realized with just 49 external components on a low-cost, four-layer printed circuit board (PCB). The only external ICs needed are a power am

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